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NIKON METROLOGY
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The Nikon Metrology XT V130 X-ray inspection system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and μBGA inspection, multi-layer board inspection and PCB solder joint inspection, it is a compact, easy-to-use, and most of all, cost-effective inspection system that is an indispensable workhorse in any electronics production area. Request more info on the new XT V 130 system High quality images
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Intuitive to use
Safety as a design criterion
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XT V 160: NanoTech X-ray electronics inspection
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The XT V 160, also known as the Revolution, has been developed utilizing X-Tek’s 20 years experience in nanofocus X-ray technology. The system provides the highest resolution and magnification possible within a compact system and is ideally suited for inspection of electronic components in production lines and failure analysis laboratories. The XT V 160 is a versatile tool that allows an operator to easily make use of the system’s manual and programmable inspection capabilities. On top of it is ready for Computed Tomography CT inspection to reconstruct the test sample in full 3D image. Designed for 100% BGA and µBGA inspection, multilayer board inspection and PCB solder joint inspection, it is a simple to use, high resolution and cost-effective inspection solution that is an indispensable workhorse for any inspection lab. |
XT V 160 inspection benefits
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XT V 160 T - Versatile X-ray inspection system for electronic applications
A versatile microfocus x-ray analysis tool for both manual and programmed inspection of electronic components and PCB assemblies. The XT H 160 T has been developed in direct response to customers requirements using the latest materials technology and X-Tek’s 20 years of experience in the design and manufacture of x-ray apparatus
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Maximum magnification - 6000x An ultra thin output window design enables the sample to be placed safely within 250 microns of the focal spot giving up to 6000x system magnification. Thanks to the Hawk’s unique pyramid transmission x-ray target, the magnification of detail on large substrates and PCBs remains at an impressive level even at steep viewing angles. High resolution - micron level features A tightly controlled microfocus x-ray spot and the latest CCD imager technology ensure that the Hawk produces sharp images of micron level features even in the most challenging samples. The single pole electron lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using high power. High penetration - 160kV The Patented X-Tek Xi “Open Tube” x-ray source is smaller than any other design and allows x-ray images of fine detail in thick and dense samples to be seen with ease. This high energy vacuum de-mountable unit allows views at steep angles through solder joints and heatsinks without ever running out of energy. |
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Viewing from any angle The large carbon fibre tray moves under manual or programme control at up to 60mm/sec in both X and Y directions making the XT H 160 T highly suitable for batch production of smaller components and assemblies. Trays loaded with samples onto custom fixturing can be snapped in and inspected using a vast library of machine vision functions linked together in quick and easy to compile routines. With the tray replaced by two precision programmable rotation axes and a custom sample fixture with a scan area of up to 310mm x 500mm, sharp high magnification images from virtually 360 degrees around the sample can be produced. For component package inspection, standard JEDEC sample trays or complete lots of IC strips can be located into the XT H 160 T's tray, dedicated software tools measure die attach void percentages and wire sweep rations. For closer examination, individual strips and tubes can be rotated to expose delamination and wire loop problems. |
The XT V 160 T has been designed for ease of use without compromising performance.
Fully adjustable shelves ensure that all system controls are at the operator’s fingertips whether standing or sitting, independent of the person’s height.
The Windows control screen is laid out logically with all regularly used functions in view on single click buttons while movement of the precision joysticks gives a direct and logical response from both sample manipulator and x-ray image.
The system is highly intuitive to operate and as a result, operator training time is significantly reduced.
| Integrated Inspect-X Software | |
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The XT V 160 T incorporates the most advanced image capture and analysis software. The resultant data can be saved or exported directly to MS Word, Excel and any other COM compliant package. Photo quality printouts can be made on a range of inkjet, laser or thermal printers. Processing hardware and software are both controlled in-house so that advances in technology can be passed on to the user without delay. Inspect-X includes special functions for inspection of semiconductor package voids, wire bonding and BGA solder bumps. It also makes use of Microsoft Visual Basic as a scripting/macro language, allowing rapid software customisation to suit specific inspection requirements. |
| Low cost of ownership | |
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Footprint Efficient The compact Xi source releases more of the XT V 160 T's volume for sample manipulation, providing a generous 20” x 14” scan area in a system footprint un-challenged by any other “open tube” x-ray system. Low Ownership Cost X-Tek’s open x-ray tube development has driven down the size, weight and cost of the system whilst maintaining superior quality and performance. By introducing a patented zero maintenance cable-less HT generator, the preventative maintenance has been dramatically reduced making the long term cost of ownership considerably lower than a sealed tube based system. |
Features
This system is purpose built for volume inspection in a production environment, either in semiconductor packaging or PCB assembly. With a sample scan area of up to 350 x 530mm, the cabinet can accommodate large samples or trays of components.
- 2 or 5 µm Focal Spot Transmission Target X-Ray Source, 25 to 160 kV, 0 to 500 µA (non continuous) 10 Watt (5µm) or 20 Watt (2µm).
- 5kg Capacity 3 axis fully programmable manipulator, 2kg capacity Tilt and Rotate.
- Attachment gives 5 fully programmable axes.
- Maximum scan area 350 x 530mm (310 x 500mm with Tilt and Rotate Attachment)
- Geometric Magnification up to: 2400x.
- System Magnification up to: 5000x.
- Feature recognition: down to 1 micron.
- External Cabinet Dimensions: 1060mm L, 1350mm D, 1955mm H.
- Full system control and image processing software.
- Semiconductor Packaging
- Package Void inspection
- biological samples
- plastic samples
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XT H 225 X-ray and CT inspection system for industrial applications
XT H 225 X-ray and CT inspection system for industrial applications
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Full inner and outer inspection of industrial components Detailed measurement of internal component and assembly features is often vital for quality control, failure analysis and material research. XT H offers powerful X-ray sources, a large inspection volume, and high X-ray and CT imaging resolution. XT H systems are available with 225kV with optional rotating target and suit a wide range of applications, including inspection of small castings, plastic parts as well as material research. |
Benefits
• Flexibility combined in a single system: X-ray for quick visual inspection, CT for in-depth analysis
• Fast data capture and high-quality images
• Fast operation with interactive joystick navigation
• High-resolution digital imaging and processing
• Embedded safety enables to operate system without any special precautions or badges
• Tight integration with industry standard post-processing applications
Request information on XT H 225
Application
• Evaluation and measurement of precision plastic parts and small castings, complex mechanisms, internal components, part-to-CAD comparison, etc.
• Fault detection and failure analysis
• Troubleshooting of assembly issues
• Advanced material research and analysis of biological structures
• Digital archiving of models
Overview key features
X-ray source
With a voltage of from 25kV up to a maximum 225 kV, the XT H 225 is suited for as both general-purpose use, such as plastics, PCB's, light alloys, small assemblies and organic or biological samples, as heavier castings, welds and high-density alloys.
Target
The micro-focus spot gives very high resolution and is the recommended standard target. Rod anodes are ideal for single wall inspection of hollow samples, such as pipe welds.
Rotating target source
An X-ray source with rotating target boosts X-ray flux by up to 5 times, enabling customers to obtain faster CT data acquisition or achieve higher CT data accuracy in the same time span.
5-axis sample manipulator
The XT H 225 has 3 linear axes and 2 rotational axes, to view the sample at any angle. The 10kg manipulator holds most sample weight to manipulate with the highest precision. The manipulator is normally controlled by variable speed joysticks. It can also be program controlled via the rack-mounted industrial PC.
X-ray image flat panel detectors
The wide choice of flat panels allows a good match for subject size and x-ray energy and provide optimum choice for sample size, field of view, and magnification requirements.
High magnification
As the sample is moved towards the x-ray source, the geometric magnification continuously increases from approximately 1X (close to the intensifier window) to 160X (touching the x-ray source).
Image processing
General NDT applications usually need the standard functions, such as contrast enhancement, image integration and background subtraction. Special functions, such as automatic die attach void and wire sweep calculations, graphic displays and colour enhancement are available for more critical analysis.
Reliability
The continuously pumped all metal x-ray tube eliminates the problems of costly failures and long replacement times of sealed glass tubes. Customer maintenance is minimal, typically requiring filament changes taking 15-minute replacement time.
System specifications
- 5 µm focal spot reflection target X-Ray Source, 25 to 225 kV, 0 to 2000 µA (non continuous) 60 or 225 Watt.
- 10kg capacity 5 axis fully programmable manipulator.
- Maximum scan area 250 x 330mm.
- Geometric magnification up to: 160x.
- System magnification up to: 400x.
- Feature recognition: down to 1 micron.
- External cabinet Dimensions: 2030mm L, 925mm D, 2000mm H.
- Full system control and image processing software.
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Large cabinet XT H 225/320 LC industrial X-ray and CT system
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The XT H 225/320 LC (Large Cabinet) system is a self contained, fork-liftable module designed for shop floor X-ray and CT inspection. The system is very flexible, allowing for many options of X-ray image detectors, X-ray sources and image processing. The users have the choice between micro-focus 225kV X-ray source with optional rotating target or 320kV source. The XT H LC features a large access door and the heavy duty. precision 5-axis manipulator can hold samples in excess of 50kg with dimensions of 0.6m (H) x 0.6m (D). Radiation shielding is to better than 1µSv/hour external, and dual fail-safe switches/relays ensure safe operation |
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XT H 450 micro-focus x-ray/CT system for inspection of blades and castings
XT H 450 LC for CT inspection of blades and castings featuringhigh power 450kV micro-focus X-ray source
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The Metris XT H 450 LC sets a new reference for turbine blade measurement and NDT of small to medium castings. At the core of this powerful equipment is a 450kV micro-focus source, providing superior resolution and accuracy. The curved linear array detector optimizes the collection of X-ray images by eliminating the scatter phenomena that typically influence 2D radiographs of blades and other metal parts. It is a flexible system that deals with small to large metal parts such as blades, castings etc. |
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CT reconstruction of turbine blade
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X-ray view of chainsaw
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FEATURES
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X-ray view of casting
CT reconstruction of casting
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